Ceva and Mobilint Advance Physical AI with REGULUS Edge AI SoC

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As AI becomes embedded across the physical world, workloads are increasingly being processed where they can run most effectively and efficiently, from the cloud to the device itself. For Physical AI systems that must sense, interpret and respond to their surroundings in real time, this is driving greater intelligence directly into power-constrained edge devices. Ceva, Inc. (NASDAQ: CEVA), the leader in silicon and software IP for the Smart Edge, today announced that Mobilint, a leading AI semiconductor company, has deployed Ceva's SensPro™ AI DSP and NeuPro-Nano™ NPU in its REGULUS edge AI System-on-Chip (SoC), marking the first production deployment of Ceva's NeuPro NPU family.

Designed as a standalone processor for on-device AI, REGULUS integrates Ceva's SensPro AI DSP and NeuPro-Nano NPN32 NPU within Mobilint's highly integrated processing architecture. Delivering 10 TOPS of AI performance at under 3W and supporting up to 8GB of memory, REGULUS is designed for real-time AI across power- and space-constrained applications including robotics, drones, machine vision, smart cameras and IoT devices.

The multi-engine architecture enables different sensing and AI workloads to run on the processing engine best suited to the task. SensPro provides programmable processing for sensing and signal-processing workloads, while NeuPro-Nano provides highly efficient neural processing for always-on inference use cases. Together, these technologies complement Mobilint's proprietary AI processing architecture, adding flexible sensing and inference capabilities to address the diverse and evolving requirements of Physical AI devices.

"REGULUS brings together the specialized processing capabilities needed to run sophisticated AI workloads directly on the device within very tight power constraints," said Dongjoo Shin, CEO of Mobilint. "Ceva's SensPro and NeuPro-Nano add flexible sensing, signal processing and inference capabilities to REGULUS, helping us address the diverse workloads our customers need to build the next generation of intelligent edge devices."

REGULUS is already enabling commercial products, including Mobilint's MLD-R1 AI USB accelerator, first previewed at COMPUTEX 2026 and now shipping. Designed to add on-device AI to existing systems, MLD-R1 supports computer vision, video analytics and generative AI workloads for applications including smart factories, robotics, machine vision, security, medical devices and digital signage, with support for widely used AI frameworks and ecosystems including PyTorch, ONNX, Hugging Face, TensorFlow, TFLite and Keras.

"REGULUS marks an important milestone for Ceva as the first production deployment of our NeuPro NPU family, demonstrating the progress we are making in bringing our AI technology into commercial silicon," said Yaron Galitzky, Executive Vice President and General Manager, AI Division at Ceva. "Together, NeuPro-Nano and SensPro provide efficient, flexible sensing and inference processing that helps address the diverse workloads Physical AI devices need to perform locally and in real time."